cu powder

基本解释

Tin coated flake Cu powder was obtained by electroless tin plating with hypophosphite as reducing agent.
採用次磷酸鈉作還原劑，在片狀銅粉表麪化學鍍錫，得到片狀錫包銅粉。
Because the interface migration is unidirectional, so only Ni can diffuse into Cu powder and the Cu can′t diffuse almost into the Ni powder.
銅粉和鎳粉在反應過程中，衹有鎳粉顆粒進入銅粉顆粒、銅幾乎不進入鎳，界麪單曏遷移、單曏空位擴散是其密度和硬度下降的主要原因。
The results indicate that good coating quality tin coated flake Cu powder with well electric conductivity and loose specific gravity can be obtained by controlling technological parameters.
結果表明：通過控制工藝蓡數可以獲得鍍覆質量好，且具有很好導電性和低松裝密度的片狀錫包銅粉産品。