wire bonding

基本解释

Wire bonding is a critical technique for realizing microwave hybrid circuit.
引线键合是实现微波混合电路的关键技术。
Gas plasma technology can be used to clean pads prior to wire bonding to improve bond strengths and yields.
气体等离子技术能够用于在引线键合前清洗焊盘以改进键合强度和成品率。
The result shows that the plastic strain at the heel region induced by wire bonding process, molding process and the thermal stress and strain in solder reflow are the main causes of heel crack.
结果显示由于引线键合工艺、注塑工艺以及回流焊中封装体各部分不同的热膨胀系数引起的热应力和塑性变形是产生引脚跟断裂的主要因素。

Today, the Commerce Department is informing the member nations of the Coordinating Committee on Multilateral Export Controls (COCOM) that the United States will decontrol the sale of wire-bonding technology to "proscribed destinations, " i.e. the Warsaw Pact.
CENTERFORSECURITYPOLICY: Center For Security Policy
Contending that wire-bonding machines were available to the Soviet Union from non COCOM-controlled foreign sources, Commerce Secretary Robert Mosbacher decided -- despite vigorous objections from the Defense Department and a contrary finding from the U.S. intelligence community -- to utilize his authority under the Export Administration Act to decontrol this technology.
CENTERFORSECURITYPOLICY: Center For Security Policy

引线键合
The experiment results show that the motion characteristics of the bond head can satisfy the requirements of IC wire bonding.
实验结果表明键合头的运动特性能够很好地满足芯片引线键合的要求。
金线键合
Regarding the requirement to stack more chips, low and long wire looping is needed in the wire bonding process.
为了适应该封装结构的需要,在金线键合这一工艺中,键合线弧要求更低、更长。
芯片焊线
线结合

引线键合
Wire bonding is the most important process in semiconductor packaging industry, that's because kinds of failure are related to this process.
引线键合工艺是半导体封装中的重点控制工序,这是由于很多失效原因与它相关。
线结合