gap-fill

基本解释

HDP have better gap fill capability than the typical PECVD technology to meet smaller features with higher aspect ratio requirement.
为了满足深亚微米集成电路工艺对成膜特性的要求，开发出了高密度等离子体化学气相淀积薄膜（HDP）技术。
Adopt unique signal gap filling technology, with good coverage, realizing seamless interference.
采用独特的信号空隙填充技术,具有良好的覆盖性,实现了无缝干扰。
The new series of golf holidays fill a gap in the market.
新的高尔夫度假系列填补了市场的一个空白。
Mistakes were corrected and gaps filled.
错误改正了,缺点也弥补了。
Tungsten is widely used in multi-level interconnection due to its excellent gap filling and anti-electromigration capability.
钨由于其优良的抗电迁徙性能和宜加工特性而被广泛应用于多层金属互连技术中。