excess solder

基本解释

Remove excess solder with small brush while plastic, leaving a fillet around end of valve as it cools.
当焊料处于粘滞状态时，用刷子把多馀的焊料清除干净。焊料冷却后，将一条嵌条环绕在阀门的端口。
Remove excess solder with small brush while plastic ( soft), leaving a fillet around end of valve as it cools.
在焊接部分成型后，用小刷子清除多余的焊料，使其在焊料冷却后形成一个环绕连接端口的圆角。
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A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable.
一种用于从电路基板垂直去除多余焊料的方法，该方法包括利用具有可吸附焊料的多个焊盘和孔的牺牲电路基板（60）。
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