ball scale

基本解释

A new kind of material which suitable for manufacturing large scale ball mill liner was successfully researched.
研究成功了一种适合于制造大型球磨机衬板的新材料。
The part is available in a 32-lead lead frame chip scale package (LFCSP), and a 25-ball wafer level chip scale package (WLCSP).
该器件提供两种封装：32引脚架构芯片级封装（LFCSP）和25引脚晶圆级芯片规模封装（WLCSP）。
Using in the large scale ball mill liner, the lifespan is fold than that of high manganese steel, production cost decreases by 15% respectively.
用于制造大型球磨机衬板，耐磨性比高锰钢衬板提高1倍以上，生产成本降低15%，具有很好的经济效益。