substrate diffusion

基本解释

The bonding between the coating layer and substrate is good and the diffusion occurs in the interface between them.
涂层与基体结合良好，界面附近存在元素扩散现象；
However, cracks initialized in the diffusion layer between substrate and bond coat when TBCs were tested with low cycle fatigue at high temperature.
而在高温低周疲劳条件下裂纹是在粘结层与高温合金基体的扩散层处。
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In process parameters, the RF power and pressure affect the number, energy and composition of the basic elements, the substrate temperature effect the surface diffusion and atomic bonding.
工艺参数中，射频功率和压强综合影响了基元数量、能量以及成分，基片温度主要影响表面扩散、原子成键。