PBGA

基本解释

• 全局灵敏度

同根派生

• PBGA相关词

英汉例句

• At the same time,experiments on PBGA solder ball laser reflow were carried out.
  同时，本文还对PBGA钎料球激光重熔进行了试验研究。
• The main aim of this paper is to study for the warpage and von Mises stress of PBGA package caused by the variations of mechanical properties of materials in IR-reflow process.
  中文摘要目前一般封装体之封装材料，即使是同一厂商所制造出相同名称的产品，其材料性质亦有差异存在，因此探讨材料性质变异对于封装体的影响是有其必要性的。
• PBGA (plastic ball grid array) assembly
  PBGA组件
• Optimization Design of Astronomic PBGA Solder Joint under Shock Load
  冲击载荷下航天用PBGA焊点的优化设计
• The Thermo-Mechanical Stress Analysis of Epoxy Molding Compound in PBGA
  PBGA中环氧模塑封装材料的热力学应力分析

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